Dustin W. Demetriou
Senior Technical Staff Member
IBM
2455 South Road Bldg. 003, NN12
Poughkeepsie, NY 12601
United States
845-313-5626
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dustin.demetriou@gmail.com
Demetriou

Dr. Dustin W. Demetriou is a Senior Technical Staff Member at IBM. He’s spent the last fifteen years helping to deliver some of the world’s most energy efficiency mission critical facilities and information technology equipment. 

Dustin is a globally recognized expert in the field of thermal management and data center energy efficiency and has taught courses and lectured on these subjects around the world. He received a Ph.D. in Mechanical and Aerospace Engineering from Syracuse University, a MS in Mechanical and Aerospace Engineering from Syracuse University and a BS in Mechanical Engineering from Manhattan College. 

His research interests include the analysis, application, and optimization of thermal management and energy conversion systems, particularly in the areas of high-density data centers, high-performance buildings, and advanced electronics cooling technologies.

Dustin is the current Vice Chair of the ASHRAE Technical Committee 9.9 (TC 9.9) IT Subcommittee and the past Chair of ASHRAE TC 9.9 on Mission Critical Facilities, Data Centers, Technology Spaces, and Electronic Equipment. He also serves as Secretary for the Liquid Subcommittee of ASHRAE SSPC 127, Method of Testing for Rating Cooling Equipment Serving Data Center (DC) and Other Information Technology Equipment (ITE) Spaces.

Dustin was the lead developer on the recently released ASHRAE TC 9.9 Datacom Encyclopedia, a comprehensive online encyclopedia with essential knowledge about important datacom topics such as facility design considerations, ITE design considerations, environmental guidelines, cooling technologies, and energy efficiency. Dustin has co-authored four books in the ASHRAE Datacom Series, authored or coauthored over thirty journal and peer-reviewed conference publications, and has been granted forty three United States patents. 

He also serves on the Executive Committee for the IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm). His work has been awarded numerous honors, including the ASHRAE Willis H. Carrier Award, All-University Doctoral Prize at Syracuse University, IEEE TCPMT Best Paper Award, ASME Journal of Electronics Packaging Best Paper Award, ASME InterPACK Best Paper Award in Data Centers and Energy Efficient Electronic Systems, and the Best Paper in the International Journal of Building Simulations.

Topic
Fundamentals of IT Equipment Design (Advanced)

 

When we design a comfort cooling solution we start with the occupant and how they will use the space. So why don’t we have a better idea about the IT going into the data center during the initial design? In this presentation, we’ll talk about the thermal-mechanical design of IT equipment and the considerations that go into a specific product. We’ll also describe the interaction of IT equipment with the data center and how trends such as artificial intelligence, machine learning, and edge computing are impacting the data center. 

What’s Needed to Decarbonize Data Centers? (Basic)
Technology and digitization are key to achieving the ambitious net zero goals necessary to mitigate the worst impacts of climate change. While reports will talk about the energy impact of data center, the data center industry has been at the forefront of working towards these goals with continual innovation in IT and data center cooling designs. In this presentation, we’ll review The Greenhouse Gas Protocol, how it applies to the data center industry, and where the biggest opportunities exist to continue pushing towards Net Zero. We’ll discuss targets and metrics across multiple disciplines: energy efficiency, renewable energy, water, circular economy, and heat reuse. Lastly, we’ll talk about the evolving data center landscape, from enterprise to colocation services to cloud services and how these impact an organization’s emissions.
The ASHRAE Thermal Guidelines for Data Centers – Past, Present and Future (Beginner))
When first established, the ASHRAE Thermal Guidelines for Data Processing Environments represented the first comprehensive set of temperature and humidity conditions, established by the IT manufacturers, that linked the design of IT equipment with the data center. They established guidance to data center operators on how to operate the IT equipment for optimal performance, highest reliability, and the lowest power consumption. In this presentation, we’ll chart the history of both the air and liquid thermal guidelines and how they’ve continually evolved to address the ever changing needs of the data center industry. The presentation will discuss how to apply the guidelines in your data center and clear up some of the common misconceptions about their use. Finally, we’ll describe the critical role ASHRAE Research has played in evolving the guidelines towards higher energy efficiency and reliability.
Is it Time for Data Center Liquid Cooling? (Intermediate)
Mainframe computers, dating back to the 1960s, implemented liquid cooling to provide performance, efficiency, and reliability. So why don’t we see it being deployed often today? In this presentation, we’ll discuss the evolution of data center cooling technologies, from liquid to air (and back to liquid?). We’ll describe the various forms of liquid cooling being used today, the considerations needed when considering these technologies in the data center, and what trends are driving the industry back towards liquid adoption (hint: efficiency, power density and sustainability). Finally, we’ll discuss ASHRAE’s role in driving liquid cooling adoption in the IT industry.